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[Industry Focus]：Investment 0.26 billion, annual output of 20000 tons of electronic grade epoxy resin project officially announced

Read： 516 Time：9months ago Source：天天化工网

On January 25, Wuhu Ecological Environment Bureau announced the environmental impact report of Anhui Jialan New Materials Co., Ltd. with an annual output of 20000 tons of new electronic materials.

芜湖市生态环境局对安徽嘉蓝新材料有限公司年产2万吨电子新材料项目.jpg

encapsulating glue is used to encapsulate electronic devices, and is a kind of electronic glue or adhesive that plays a role in sealing, encapsulating or potting. Electronic devices can play the role of waterproof, moisture-proof, shockproof, dustproof, anti-corrosion, heat dissipation, confidentiality, etc. after electronic packaging. Therefore, the electronic packaging adhesive needs to have the characteristics of high and low temperature resistance, high dielectric strength, good insulation, environmental protection and safety. With the country to enhance the layout of electronics, software, chips and other scientific and technological fields, the rapid development of the domestic electronics industry, electronic grade epoxy resin market demand continues to expand.

Project Overview

Project name: 20000 tons of new electronic materials project

Project Nature: New

Construction site: Chemical Industry Park of Wuhu Economic and Technological Development Zone

Construction unit: Jialan Anhui New Material Co., Ltd

construction content and scale: the project covers an area of 28307 square meters, with a total construction area of 17000 square meters. Auxiliary facilities such as production workshop, warehouse, comprehensive building, power center, tank farm and hazardous waste temporary storage warehouse will be built. After the completion of the project, the annual output of the project is 20000 tons of bisphenol A epoxy resin;

project investment: 360 million yuan

construction period: October 2023 ~ August 2025

product Scheme

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Electronic Component Packaging Materials: Epoxy Challenges and Opportunities

with the rapid development of electronic technology, large-scale integrated circuits and micro electronic components are more and more widely used. However, with the miniaturization and high integration of devices, heat dissipation has become a key factor affecting their service life. Therefore, a high thermal conductivity adhesive with excellent heat dissipation performance has become an important demand for packaging materials.

epoxy resins have been widely used as electronic packaging materials for their excellent heat resistance, electrical insulation, adhesion, dielectric properties, mechanical properties, and low shrinkage and chemical resistance. Epoxy resins exhibit good processability and operability upon addition of an appropriate curing agent, and thus epoxy resins dominate the field of semiconductor device packaging.

However, in the face of the increasing awareness of environmental protection and the increasingly stringent performance requirements of the integrated circuit industry for electronic packaging materials, epoxy resins are also facing new challenges. In addition to the need to maintain high purity, how to reduce stress, improve thermal shock resistance and reduce water absorption has become an urgent problem to be solved.

In order to cope with these challenges, researchers at home and abroad mainly adopt two strategies of blending modification and synthesis of new epoxy resins from the perspective of molecular structure design. On the one hand, by introducing biphenyl, naphthalene, sulfone and other groups and fluorine elements into the epoxy skeleton, in order to improve the moisture and heat resistance of the material; on the other hand, by selecting the appropriate curing agent, the curing kinetics, glass transition temperature, thermal decomposition temperature and water absorption properties of the cured product were studied to prepare high-performance epoxy resin for electronic packaging materials.

Research in this area not only has a significant impact on the performance and life of electronic components, but also opens up new possibilities for the application of epoxy resins in a wider range of fields.

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