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[Chemical Knowledge]：POP detection methods and analysis techniques

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POP detection method

With the popularity of the Internet and the rapid development of electronic products, POP(PackageOnPackage) technology, as an advanced packaging technology, is widely used in the packaging and connection of integrated circuits. The core of POP technology is to package multiple chips in the same package to achieve higher integration and performance. With the increase of integration and packaging density, the detection and analysis of POP technology is becoming more and more important.

1.1 non-contact detection method

The non-contact detection method refers to the detection and analysis of the measured piece by means of sensors or optical equipment without contacting the measured piece. In POP technology, commonly used non-contact detection methods include infrared thermal image detection, laser scanning and X-ray detection.

Infrared thermal image detection: use infrared thermal imager to scan the POP package, and identify possible welding defects or short circuit problems by detecting the temperature difference in different areas. Laser scanning: 3D measurement of POP package is carried out by laser scanning technology to realize rapid detection of parameters such as package morphology, solder joint spacing and welding quality. X-ray inspection: Using X-ray transmission characteristics, high-resolution non-destructive inspection of the welding situation and component layout inside the POP package.

1.2 contact detection method

The contact detection method refers to the detection and analysis of the measured piece by directly contacting the measured piece or applying a certain pressure on the surface of the measured piece. In POP technology, the commonly used contact detection methods include probe test, microscope inspection and infrared hot plate detection.

Probe test: The micro probe is used to test the solder joints of POP package, and the resistance, capacitance and connectivity of the solder joints are detected to judge the welding quality and connection reliability. Microscope inspection: With the help of high-power microscope or micro camera, the surface and solder joints of POP package are magnified to observe to find small defects and welding abnormalities. Infrared hot plate inspection: The POP package is placed on the preheated infrared hot plate, and the welding quality and the stability of the package structure are evaluated by observing the temperature change and thermal distribution of the package surface.

POP Analysis Techniques

In addition to detection methods, analytical techniques also play a vital role in the research and application of POP technology. Through the analysis and processing of the test data, the key factors such as package quality, process parameters and equipment performance can be understood more deeply, which provides an important reference for optimizing the packaging process and improving product quality.

2.1 Data Mining and Machine Learning

Data mining and machine learning techniques are playing an increasingly important role in the analysis of POP encapsulation. Through the collection, collation and analysis of a large number of detection data, the laws and characteristics hidden behind the data can be found, so as to guide the optimization and improvement of the packaging process.

Feature extraction: Data mining technology is used to extract valuable features and parameters from the original inspection data, such as solder joint shape, package structure and electrical characteristics. Pattern recognition: With the help of machine learning algorithms, the extracted features are analyzed and classified, different package quality and process anomalies are identified, and intelligent package quality control and management are realized.

2.2 finite element analysis and simulation

Finite element analysis and simulation is an engineering analysis method based on numerical calculation, which can simulate and predict the structural behavior and performance response of complex systems. In POP technology, finite element analysis and simulation can help engineers better understand the mechanical properties and thermal behavior of the package structure, and guide package design and process optimization.

Mechanical analysis: Through finite element analysis, the stress of POP package under different loads and environmental conditions is simulated and calculated to evaluate the strength and stability of the package structure. Thermal Simulation: Using Simulation Software

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