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[Chemical Knowledge]：Difference and Application Analysis of Polymer and Low Molecular Binder

Read： 667 Time：19months ago Source：Transform the World with Simplicity

In industrial production and daily life, binder is an indispensable material. According to its molecular structure, binders can be divided into two types: high molecular and low molecular, which have significant differences in physical and chemical properties.

from the molecular structure, the molecular weight of the polymer binder is relatively large, mainly composed of long-chain polymers, while the molecular weight of the low-molecular binder is small, mainly composed of short-chain polymers. This difference leads to their different characteristics in practical applications.

polymer binder has high mechanical strength and tensile resistance due to its large molecular weight and long chain length. This makes polymer adhesives have obvious advantages in occasions where high-strength bonding is required, such as aerospace, automobile manufacturing and other fields. The low molecular adhesive is because of the small molecular weight, strong mobility, more suitable for the bonding strength is not high, but the need for rapid curing occasions, such as furniture manufacturing, daily repair and other fields.

In addition, the polymer binder has high heat resistance and corrosion resistance due to the cross-linked structure of the molecular chain, and can maintain good bonding performance in a relatively harsh environment. However, the low molecular adhesive may be greatly affected by temperature and chemical medium, and it needs to be used under relatively mild conditions, otherwise the adhesive performance may decrease.

In summary, although there are significant differences in molecular structure and application characteristics between polymer binders and low molecular binders, they have a wide range of applications in different fields. In actual production and engineering practice, it is necessary to select the appropriate adhesive type according to the specific bonding requirements and application scenarios, so as to achieve the best bonding effect.

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