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[Chemical Knowledge]：Carbon production and manufacturing methods and processes.

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In the field of raw materials for chemical production, there are two main methods for manufacturing carbon: chemical vapor deposition and physical vapor deposition. These two methods can be used to prepare high-purity, high-performance carbon materials, with their own characteristics and scope of application.

1. Chemical Vapor Deposition

Chemical Vapor Deposition (CVD) is a technique in which a gaseous precursor is chemically reacted on the surface of a heated substrate to form a solid carbon thin film. This method can be used to prepare carbon thin films on substrates of various shapes and materials, and the composition, structure and performance of the thin films can be adjusted by controlling the reaction conditions and the type of precursors.

1. Reaction principle

In the CVD method, gaseous precursors (such as methane, ethylene and other hydrocarbon gases) undergo pyrolysis reactions under high temperature conditions to generate carbon atoms and hydrogen. Carbon atoms are deposited on the surface of the substrate to form a carbon film. At the same time, hydrogen gas is discharged out of the reaction chamber as a byproduct.

2. Process
The process of preparing carbon thin films by
CVD method mainly includes the following steps:

(1) Cleaning the substrate: the substrate is cleaned to remove oil stains and oxides on the surface.

(2) Heating the substrate: The substrate is heated to a desired temperature, typically a few hundred degrees Celsius to one thousand degrees Celsius.

(3) introducing a precursor gas: introducing a gaseous precursor into the reaction chamber to cause a chemical reaction on the surface of the substrate.

(4) Deposition of carbon thin film: By controlling the reaction time and precursor flow rate, carbon is deposited on the surface of the substrate to form a thin film.

(5) Cooling and taking out: After completion of the reaction, the substrate was cooled to room temperature, and the carbon thin film was taken out.

2. Physical Vapor Deposition

Physical Vapor Deposition (PVD) is a technique for depositing a carbon material on a surface of a substrate by a physical method such as evaporation, sputtering, etc. This method is suitable for the preparation of carbon films with high hardness and high wear resistance, and is widely used in the surface strengthening of tools, molds and other fields.

1. Reaction principle

In the PVD method, the carbon material is evaporated or sputtered into gaseous atoms or ions by physical methods, and then deposited on the surface of the substrate to form a carbon film. Commonly used physical methods are vacuum evaporation, ion plating and sputtering.

2. Process
The process of preparing carbon thin film by
PVD method mainly includes the following steps:

(1) Cleaning the substrate: cleaning the substrate to remove the oil and oxides on the surface.

(2) Placement in a vacuum chamber: The cleaned substrate is placed in a vacuum chamber.

(3) Vacuum: Use a vacuum pump to extract the gas in the vacuum chamber to reach a certain degree of vacuum.

(4) Heating Evaporation or Sputtering: The carbon material is evaporated or sputtered into gaseous atoms or ions by heating or sputtering.

(5) Deposition of carbon thin film: gaseous atoms or ions are deposited on the surface of the substrate to form a carbon thin film. Removal and cooling

(6): After the end of deposition, the substrate was removed and cooled to room temperature.

In general, chemical vapor deposition and physical vapor deposition are both effective methods for preparing carbon films, and suitable methods can be selected according to specific needs and conditions. At the same time, the carbon films prepared by different methods are also different in terms of composition, structure, performance, etc., and need to be selected and optimized according to specific application scenarios.

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