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[Chemical Knowledge]：Understand the principle of vacuum bonding machine to make production more efficient

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Vacuum bonding machine is a kind of bonding equipment between different materials under high temperature, high pressure and high vacuum conditions, which is widely used in semiconductor and electronic manufacturing and other fields. The vacuum bonding machine is mainly composed of upper and lower pressure plates. The material to be bonded is placed between the upper and lower pressure plates, and the bonding of the material is realized through high temperature, high pressure, high vacuum, high heat diffusion and other conditions. The principle of

vacuum bonding machine mainly has the following aspects:

1. pressure balance and lateral bearing

vacuum bonding machine in the process of bonding, relying on the upper and lower pressure plate to clamp the material, to achieve sealing, through the internal vacuum pump to extract the gas in the system, the formation of low pressure environment, and finally achieve pressure balance.

need to withstand lateral forces and achieve high-precision alignment during the material bonding process, which requires the design of suitable upper and lower pressure plates to ensure that the material can be bonded without deformation.

2. Temperature and time control
The
vacuum laminating machine needs to control the heat source to ensure that the corresponding bonding temperature is reached, and at the same time control the power of the heat source and the temperature distribution of the bottom material to avoid overheating during bonding or welding The temperature drops.

In addition, bonding time is also an important control parameter. Different materials require different bonding times to ensure bonding quality.

3. Vacuum environment control

During the operation of the vacuum laminating machine, in order to prevent the influence of oxidation and dust, it is necessary to combine the vacuum environment to strictly control impurities such as oxygen within the specified range to achieve high-quality material bonding. The

vacuum bonding machine uses vacuum adsorption to adsorb the material on the silicone wafer, and maintains the material surface within the height limit of a few millibars under low vacuum, which improves the bonding efficiency.

4. Automation control

In the field of manufacturing, automation is an important development direction, and the vacuum bonding machine is no exception. Automatic control can improve production efficiency and quality, and avoid the impact of manual operation errors. The

is controlled by the program, and the vacuum bonding machine can automatically move up and down the board, detect the temperature and vacuum value, optimize the bonding parameters, and ensure the bonding quality.

final summary:

vacuum bonding machine as an efficient bonding technology, widely used in semiconductor and electronic manufacturing and other fields, due to its complexity and high demand for precision, need to use professional technology and equipment to achieve.

With the development of automation technology and the continuous improvement of bonding technology, vacuum bonding machines will increasingly play their advantages, improve production efficiency and industrial quality, and become an important support for the development of manufacturing industry.