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[Product Features]]
SQ ME 2100 series epoxy resin system is made of epoxy resin and modified anhydride. It has good mechanical properties, excellent electrical properties, very high heat resistance, and excellent weather resistance and chemical resistance.
[Product Advantage]]
(1) to adapt to the current pouring equipment process, at the same time to adapt to the static and mixing process.
(2) Super high and low temperature cracking resistance
(3) can meet the requirements of high heat resistance and high toughness at the same time
[Application Field]]
suitable for various types of dry-type transformer products.
[Technical Indicators]]
[Product Advantages]]
1. excellent low heat release performance
the choice of curing process has a great influence on the internal stress of the cured product. The curing of epoxy resin is an exothermic reaction. If the curing rate is too fast, it will cause the viscosity to suddenly increase, and the heat cannot be released in time, resulting in thermal stress and affecting the product qualification rate.
[Test Method] Taking epoxy composite 2103(S)A/B as an example, curing experiments were carried out to record the temperature change curve inside the material during curing. As shown in Figure 1:
[Advantage] The epoxy composite material has a low heat release rate during the curing process, which is conducive to the release of heat generated by curing, greatly reduces the thermal stress retention in the product, and improves the product qualification rate.
the curing of epoxy resin is an exothermic reaction. If the curing rate is too fast, it will cause the viscosity to suddenly increase, and the heat cannot be released in time, resulting in thermal stress and affecting the product qualification rate.
SQ ME2100 series epoxy composite has a low heat release rate during curing, which is conducive to the release of heat generated by curing and greatly reduces the thermal stress retention in the product.
2. excellent settlement resistance and high permeability
in the actual use of epoxy composite materials, it is often necessary to add inorganic fillers to improve the performance of the material. However, the pre-filled epoxy materials have sedimentation during the production and storage process, resulting in inconsistent density of the upper and lower layers of the pre-filled materials. This greatly affects the uniformity of the material during the pouring process and damages the product quality.
[Test Method]]
1. According to the principle of time-temperature equivalence, a storage stability test method is developed: the dispersed SQ ME2103SB is put into a transparent sample bottle, and then the sample bottle is placed in an oven at 80 ℃, and the mixture at the upper and lower parts of the sample bottle is taken for a period of time to test the filler content and record the content change.
Compared with the curing agent component filled with ordinary silicon micropowder, SQ ME 2103S B treated by special process has excellent stability. It is placed in an oven at 80 ℃, and has no obvious change for 24 hours, while only a small amount of sedimentation delamination occurs for 72 hours.
From the comparison in the figure, it can be seen that the epoxy composite material 55% the filling content of silicon micropowder is taken as an example. As shown in Figures 2 and 3, the fineness of silicon micropowder is about small, and the larger the particles, the higher the anti-sedimentation performance; the fineness of silicon micropowder The larger the degree, the smaller the particles, the better the anti-sedimentation performance.
After silane modification by our company, the anti-sedimentation ability of the system has been improved. The SQ ME2103S developed by our company has been designed with special formula process, and the upper and lower fillers are almost the same.
The product has low initial mixed viscosity, high filler content, long pot life at 80°C, short gel time at high temperature, and has good mechanical properties, excellent electrical properties, very high heat resistance, and excellent crack resistance.
3. suggested curing process
SQ ME2106S Vacuum Casting & Curing Process
[mixing ratio] SQ ME2106 SA/SQ ME 2106 SB = 100:100
suggested Curing Process]]
80 ℃ × 6h +110 ℃ × 2h +130 ℃ × 10h, temperature rise 0.5h between stages
[Precautions]]
(1) Before moving the product out of the curing furnace, it is slowly cooled to about 80-90 ℃ with the furnace;
(2) quick demoulding, action to clear
(3) after demoulding, place it back to the curing furnace, and cool it with the furnace to below 50 ℃ (cooling time is recommended to be more than 8h) ☆ ☆
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