XYLOK-phenol biphenyl (XYLOK-phenol biphenyl)

Bargaining 10-21 09:11 Update

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XYLOK-phenol biphenyl

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Product Description

XYLOK phenolic epoxy resin

[Product Features]]

XYLOK phenolic epoxy resin has good flame retardancy, high heat resistance, high reliability, flame retardancy, low water absorption and low thermal expansion coefficient, and has good processing performance.

[Application Field]]

it is suitable for epoxy molding compound (EMC), copper clad laminate (CCL) and other electrical insulation fields for IC packaging.

[Molecular Structure Formula]]

[Product Indicators]]

Phenol biphenyl epoxy resin

[Product Features]]

phenol biphenyl epoxy resin has excellent heat resistance, low moisture absorption, intrinsic flame retardant characteristics, high toughness, good adhesion, low dielectric constant, cured resin shows good dimensional stability and chemical stability.

[Application Field]]

application of halogen-free green plastic sealing material, electronic sealing material, environmental protection CCL laminate, flexible circuit board, anti-etching ink, photosensitive solder resist ink, thermal curing solder resist ink; Heat-resistant vinyl resin and other heat-resistant materials, molding materials, coatings, adhesives and other fields.

[Molecular Structure Formula]]