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Dicyclopentadiene phenol epoxy resin
[Product Features]]
in addition to the benzene ring, the dicyclopentadiene phenol epoxy resin has an alicyclic structure of dicyclopentadiene in its molecular structure, which has excellent heat resistance, low moisture absorption, low dielectric constant and high adhesion and sealing properties. The cured resin exhibits good heat resistance and chemical stability.
[Application Field]]
plastic sealing materials, electronic sealing materials, high Tg PCB laminates, flexible circuit boards, solder resist inks and other heat-resistant materials, molding materials; Coatings, adhesives, etc.
[Molecular Structure Formula]]
[Product Indicators]]
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