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Phenolic resin-biphenyl phenolic resin for electronic materials (Phenolic resin-biphenyl phenolic resin for electronic materials)

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Phenolic resin-biphenyl phenolic resin for electronic materials

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Product Description

[Product Description]]

high purity linear biphenyl (Biphenyl) phenolic resin, this series of products have narrow molecular weight distribution, low free phenol and impurity ion content, all reaching ppm level, and have significantly better heat resistance and moisture absorption properties than ordinary linear PN resins And dielectric properties, suitable for high-end packaging molding compounds and packaging carrier plates, providing excellent heat resistance and stable mechanical properties for epoxy molding compounds.

[Technical Indicators]]

[Packaging and Storage]]

granular resin: The packaging form is a double composite kraft paper bag with a plastic film interlayer in the middle as the outer layer and a PE plastic bag in the inner layer, which generally holds a weight of 20kg. Resin must be stored in a cool, ventilated and dry place (below 25 ℃), avoid direct sunlight and stay away from heat sources. During storage and transportation, the resin will agglomer when it comes into contact with heat sources or moisture, and the color of the resin will become darker over time.

For products with softening point lower than 90 ℃, it is recommended to refrigerate and transport at 10-20 ℃ to prevent caking. The product is valid for one year. For specific storage and transportation measures, please refer to MSDS.

Nitrogen-containing phenolic resin

[Product Description]]

A special phenolic resin containing a triazine ring structure is characterized by a triazine ring structure in the molecule. The triazine ring is a chemical structure with stable chemical properties, which can provide higher heat resistance to composite materials. At the same time, the nitrogen element in the structure can be synergistic with the system containing phosphorus element, and has the effect of nitrogen and phosphorus synergistic flame retardant. It is recommended for halogen-free flame retardant systems of copper clad laminates, molded plastics and other composite insulation material systems.

[Technical Indicators]]

remarks:

(1) Nitrogen-containing phenolic resin series is easily soluble in solvents such as propylene glycol methyl ether (PM) and dimethylformamide (DMF), and suitable solvents can be selected according to needs;

(2) When the nitrogen-containing phenolic resin series is used as a solid form, the storage stability is very good, and after being prepared as a solution, it has the properties of heating and curing. Attention should be paid to its storage temperature and time.

[Packaging and Storage]]

granular resin: The outer package is a heat-sealed square bottom bag with three layers of kraft paper lined with PE layer, and the holding weight is generally 20kg. Resin must be stored in a cool, ventilated and dry place (below 25 ℃), avoid direct sunlight and stay away from heat sources. During storage and transportation, the resin will agglomer when it comes into contact with heat sources or moisture, and the color of the resin will become darker over time. The shelf life is 1 year. Please refer to MSDS for specific storage and transportation measures.