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Phenolic resin for electronic materials-linear phenol-formaldehyde resin (Phenolic resin for electronic materials-linear phenol-formaldehyde resin)

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+86 19117288062

Contact person： Chemwin

Phone： +86 19117288062

Phenolic resin for electronic materials-linear phenol-formaldehyde resin

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Product Description

[Product Features]]

the linear bisphenol A formaldehyde resin prepared by the polycondensation of bisphenol A and formaldehyde has a narrow molecular weight distribution and low free monomer content. Its special structure provides its products with higher toughness and heat resistance than ordinary phenolic resins. And the resin has excellent color stability.

[Application Field]]

suitable for lead-free FR-4 copper clad laminate and special epoxy resin intermediate.

[Product Indicators]]

[Application Examples and Performance Data]]

the linear BPA formaldehyde resin and epoxy resin (SQCN-704M) are mixed according to the equivalent ratio, the quantitative dimethylimidazole is added as a curing accelerator, the S/G of the material is tested, and the curing reaction is carried out at 150 ℃ for 2 hours to prepare a resin casting block. The Tg of the curing resin casting block is tested by DSC, as shown in the attached figure.

evaluation formula: EPOXY:SQCN704M, equivalent ratio = 1:1,2-MI 0.1%

[Packaging and Storage]]

sheet resin: The packaging form is a composite kraft paper bag as the outer layer, and the inner layer is PE or PP plastic inner bag, and the holding weight is generally 20kg. Resin must be stored in a cool, ventilated and dry place (below 25 ℃), avoid direct sunlight and stay away from heat sources. During storage and transportation, the resin will agglomer when it comes into contact with heat sources or moisture, and the color of the resin will become darker over time. Products with softening point lower than 85 ℃ are recommended for cold storage and transportation. The storage temperature below 15 ℃ and the storage and transportation requirements for products with softening point higher than 85 ℃ can be appropriately relaxed for one year.

XYLOK phenolic resin

[Product Features]]

the high-purity phenol aralkyl resin with XYLOK special structure has good mechanical properties, good chemical stability, high heat resistance, good water resistance, small shrinkage during hardening, and stable product size.

[Application Field]]

it is suitable for epoxy molding compound (EMC), copper clad foil (CCL) and other electrical insulation fields for IC packaging.

[Product Indicators]]

[Application Examples and Performance Data]]

XYLOK resin and epoxy resin (SQCN-704M) are mixed in equal equivalent ratio, quantitative dimethylimidazole is added as curing accelerator, S/G of the material is tested, and the resin casting block is made by curing reaction at 150 ℃ for 2 hours. DSC is used to test Tg of curing resin casting block, as shown in the attached figure.

evaluation formula: EPOXY:SQCN704M, equivalent ratio = 1:1,2-MI 0.1%

[Packaging and Storage]]

sheet resin: The packaging form is a composite kraft paper bag as the outer layer, and the inner layer is PE or PP plastic inner bag, and the holding weight is generally 20kg. Resin must be stored in a cool, ventilated and dry place (below 25 ℃), avoid direct sunlight and stay away from heat sources. During storage and transportation, the resin will agglomer when it comes into contact with heat sources or moisture, and the color of the resin will become darker over time. Products with softening point lower than 85 ℃ are recommended for cold storage and transportation. The storage temperature is below 15 ℃, and the storage and transportation requirements for products with softening point higher than 85 ℃ can be appropriately relaxed, with a storage period of 1 year.