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Phenolic resin for electronic materials-solvent phenolic resin (Phenolic resin for electronic materials-solvent phenolic resin)

Bargaining 10-21 09:11 Update

Inquiry

Whatsapp:
+86 19117288062

Contact person： Chemwin

Phone： +86 19117288062

Phenolic resin for electronic materials-solvent phenolic resin

Warehouse

Services Merchant Delivery

Payment Method T/T ; L/C ;

Shipping Fee Place of delivery： Need to ask for quotation with the seller

Specification weight

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Product Description

[Product Features]]

in order to help customers improve production efficiency, solid PN resin or BPA resin is dissolved into MEK to obtain phenolic resin solution with solid content of 60% or 65%. The product quality is stable, and solution products of different specifications can be customized according to customer needs.

[Application Field]]

FR-4, CEM copper clad laminate, insulating materials and other composite materials.

[Product Indicators]]

[Packaging, Storage and Transportation]]

generally, 200L small open steel drum is used for packaging, with a net weight of 200kg, while 20L tinplate drum is used for small packaging, with a net weight of 20kg. Resin must be stored in a cool, ventilated and dry place, away from heat source and dust, and fire fighting facilities should be arranged on site. Avoid direct sunlight during transportation and stay away from heat sources.

[Storage Period] One year (below 25 degrees C).