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Phenolic resin for electronic materials-linear phenol formaldehyde resin (Phenolic resin for electronic materials-linear phenol formaldehyde resin)

Bargaining 10-21 09:11 Update

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+86 19117288062

Contact person： Chemwin

Phone： +86 19117288062

Phenolic resin for electronic materials-linear phenol formaldehyde resin

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Product Description

Electronic resin is a high-purity linear phenolic resin prepared by the condensation reaction of phenol and formaldehyde, with narrow molecular weight distribution, low content of free phenol and impurity ions, and reaching ppm level, providing excellent heat resistance and stable mechanical properties for electronic devices. It is recommended to be applied to FR-4, CEM copper clad laminate, insulating materials and other composite materials. Low molecular weight linear phenol formaldehyde resin can also be used as an intermediate for special epoxy resin.

[Application Field]]

it is suitable for epoxy plastic sealing materials and copper clad laminate fields. Low molecular weight can be used as intermediate of special epoxy resin.

[Product Indicators]]

[Application Examples and Performance Data]]

the linear phenol formaldehyde resin and epoxy resin (SQCN-704M) are mixed according to the equivalent ratio, the quantitative dimethylimidazole is added as a curing accelerator, the S/G of the material is tested, and the curing reaction is carried out at 150 ℃ for 2 hours to make a resin casting block. The Tg of the curing resin casting block is tested by DSC, as shown in the attached figure.

evaluation formula: EPOXY:SQCN704M, equivalent ratio = 1:1,2-MI 0.1%

[Packaging and Storage]]

flake/granular resin: The packaging form is a composite kraft paper bag as the outer layer, and the inner layer is PE or PP plastic inner bag, and the holding weight is generally 20kg. Resin must be stored in a cool, ventilated and dry place (below 25 ℃), avoid direct sunlight and stay away from heat sources. During storage and transportation, the resin will agglomer when it comes into contact with heat sources or moisture, and the color of the resin will become darker over time. Products with softening point lower than 85 ℃ are recommended for cold storage and transportation. The storage temperature below 15 ℃ and the storage and transportation requirements for products with softening point higher than 85 ℃ can be appropriately relaxed for one year.